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| ASMT-QTC0-0xxxx PLCC-4 Black Body Surface Mount Tricolor LED Data Sheet Description This family of SMT LEDs is packaged in the industry standard PLCC-4 package with additional heat sinking capability enabling it to be driven at even higher current. These SMT LEDs have high brightness and reliability performance and are designed to work under a wide range of environmental conditions. This high reliability feature makes them ideally suited to be used under indoor full color signs application conditions. To facilitate easy pick & place assembly, the LEDs are packed in EIA-compliant tape and reel. Every reel will be shipped in single intensity and color bin; except red color to provide close uniformity. These LEDs are compatible with reflow soldering process. Its wide viewing angle at 115 together with the built in reflector pushing up the intensity of the light output makes these LED suitable to be used in the interior electronics signs. The full black body of the LED provides extreme contrast enhancement for fine pitch and short viewing distance full color display. Features * Industry Standard PLCC-4 package (Plastic Leaded Chip Carrier) with additional heat sinking capability * High reliability LED package with silicone encapsulation * Full black LED body * High brightness using AlInGaP and InGaN dice technologies * Wide viewing angle at 115 * Compatible with reflow soldering process * JEDEC MSL 2a Applications * Indoor full color display CAUTION:LEDs are Class 1C ESD sensitive. Please observe appropriate precautions during handling and processing. Please refer to Avago Application Note AN-1142 for additional details. Package Dimensions 3.40 0.20 2.50 0.20 0.80 0.10 2.90 3.20 0.20 3.60 0.20 1.76 0.20 2.00 0.20 0.15 0.20 2.50 0.20 0.70 0.20 0.97 0.20 0.80 0.20 Notes: 1. All Dimensions are in millimeters 2. Tolerance = 0.2 mm unless otherwise specified 3. Terminal Finish: Ag plating Lead Configuration 1 2 3 4 Cathode Common Anode Cathode Cathode Blue Green Circuit Diagram Red Figure 1. Package drawing Table 1. Device Selection Guide Part Number ASMT-QTC0-0xxxx Color 1 AlInGaP Red Color 2 InGaN Green Color 3 InGaN Blue Color 1 - Red Min. Iv @20mA Part Number ASMT-QTC0-0AA02 Bin ID S1 (mcd) 180 Color 2 - Green Min. Iv @ 20mA Bin ID T1 (mcd) 285 Color 3 - Blue Min. Iv @ 20mA Bin ID R1 (mcd) 112.50 Typ. Iv @20mA (mcd) 315 Typ. Iv @ 20mA (mcd) 470 Typ. Iv @ 20mA (mcd) 140 Notes: 1. The luminous intensity IV, is measured at the mechanical axis of the LED package. The actual peak of the spatial radiation pattern may not be aligned with this axis. 2. Tolerance = 12 % 2 1.34 0.20 Package Marking 0.5 0.1 Part Numbering System A S M T -Q T C0- X1 X2 X3 X4 X5 Packaging Option Color Bin Selection Intensity Bin Limit Intensity Bin Selection Device Specification Configuration Table 2. Absolute Maximum Ratings (TA = 25C) Parameter DC forward current [1] Peak forward current [2] Power dissipation Reverse voltage Maximum junction temperature Tj max Operating temperature range Storage temperature range Red 50 100 120 4V[3] 125 Green & Blue 30 100 117 Unit mA mA mW V C C C - 40 to + 110[4] - 40 to + 110 Note: 1. Derate linearly as shown in Figure 5a & 5b. 2 Duty Factor = 0.5%, Frequency = 500Hz 3. Driving the LED in reverse bias condition is suitable for short term only 4 Refer to Figure 5a and figure 5b for more information Table 3. Optical Characteristics (TA = 25C) Peak Wavelength, p (nm) Typ. 629 521 465 Dominant Wavelength, d (nm) [1] Color Red Green Blue Viewing Angle 21/2[2] (Degrees) Typ. 115 115 115 Luminous Efficacy V[3] (lm/W) Typ. 200 530 70 Luminous Efficiency e (lm/W) Typ. 22 22 5 Total Flux / Luminous Intensity [4] V / IV (lm/cd) Typ. 2.60 2.60 2.60 Min 618 525 465 Typ. 621 528 470 Max 628 535 475 Notes: 1. The dominant wavelength is derived from the CIE Chromaticity Diagram and represents the perceived color of the device. 2. 1/2 is the off axis angle where the luminous intensity is 1/2 the peak intensity 3. Radiant intensity, Ie in watts / steradian, may be calculated from the equation Ie = IV / V, where IV is the luminous intensity in candelas and V is the luminous efficacy in lumens / watt. 4. V is the total luminous flux output as measured with an integrating sphere at mono pulse condition. 3 Table 4. Electrical Characteristics (TA = 25C) Forward Voltage, VF (V) [1] Color Red Green Blue Reverse Voltage VR @ 100A Max. 2.40 3.90 3.90 Reverse Voltage VR @ 10A Min. 4 4 Thermal Resistance RJ-P (C/W) Typ. 95 70 60 Min 1.80 2.80 2.80 Typ. 2.10 3.20 3.20 Min. 4 - Note: 1. Tolerance 0.1V 1.0 RELATIVERELATIVE INTENSITY INTENSITY 0.8 1.0 0.6 0.8 0.4 0.6 0.2 0.4 0.0 0.2 0.0 380 430 480 530 580 630 WAVELENGTH - nm InGaN Blue InGaN Blue InGaN Green InGaN Green AlInGaP Red AlInGaP Red FORWARD CURRENTCURRENT - mA FORWARD - mA 680 680 730 730 780 780 50 45 40 50 35 45 30 40 25 35 20 30 15 25 10 20 5 15 0 10 AlInGaP AlInGaP InGaN InGaN 2 3 FORWARD VOLTAGE - V RELATIVERELATIVE LUMINOUS INTENSITY (NORMALIZATION AT 20 mA) LUMINOUS INTENSITY (NORMALIZATION AT 20 mA) 380 430 480 530 580 630 Figure 2. Relative intensity vs. wavelength WAVELENGTH - nm 3.00 2.50 3.00 2.00 2.50 1.50 2.00 1.00 1.50 0.50 1.00 0.00 0.50 0 0.00 0 10 10 5 0 0 1 2 3 Figure 3. Forward current vs. forward voltage FORWARD VOLTAGE - V 0 1 4 4 AlInGaP AlInGaP InGaN InGaN 20 30 40 DC FORWARD CURRENT - mA 20 30 40 DC FORWARD CURRENT - mA 50 50 60 60 Figure 4. Relative Intensity vs. forward current 4 60 MAX. ALLOWABLE DC CURRENT (mA) 50 40 30 InGaN 20 10 0 0 20 40 60 80 AMBIENT TEMPERATURE (C) 100 120 AlInGaP MAX. ALLOWABLE DC CURRENT (mA) 60 50 40 30 InGaN 20 10 0 0 20 40 60 80 AMBIENT TEMPERATURE (C) 100 120 AlInGaP Figure 5a. Maximum forward current vs. ambient temperature. Derated based on TJMAX = 125C.(3 chips) Figure 5b. Maximum forward current vs. ambient temperature. Derated based on TJMAX = 125C. (single chip) 1 DOMINANT WAVELENGTH SHIFT- nm (NORMALIZED AT 20mA) 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0.1 0 NORMALIZED INTENSITY 7 6 5 4 Green Blue Red 10 20 30 40 50 -90 -60 -30 0 30 60 ANGULAR DISPLACEMENT - DEGREES 90 3 2 1 0 -1 0 -2 -3 FORWARD CURRENT - mA Figure 7. Dominant wavelength shift (normalized at 20mA) vs. forward current Figure 6. Radiation pattern. 10 NORMALIZED LUMINOUS INTENSITY FORWARD VOLTAGE SHIFT - V Red Green Blue 1 0.30 0.20 0.10 0.00 -0.10 -0.20 -0.30 -0.40 -50 -25 0 25 50 75 TJ - JUNCTION TEMPERATURE - C 100 125 Green Red Blue 0.1 -50 -25 0 25 50 75 100 125 TJ - JUNCTION TEMPERATURE - C Figure 8. Relative Intensity Shift vs Junction Temperature Figure 9. Forward Voltage Shift vs Junction Temperature 5 0.8 1.1 0.80 x 4 (2) (3) A A C C A C 7. 0 0. 4 0. 4 0.90 x 4 1.2 x 2 3.8 Package Marking (1) (4) Solder Mask A C Anode Cathode 1.2 7. 0 0.75 x 2 Figure 10. Recommended soldering land pattern. 20 SEC. MAX. 10 to 30 SEC. TEMPERATURE TEMPERATURE 240C MAX. 3C/SEC. MAX. 100-150C 3C/SEC. MAX. 120 SEC. MAX. TIME Figure 11. Recommended leaded reflow soldering profile 60-150 SEC. 183C -6C/SEC. MAX. 217C 200C 150C 3 C/SEC. MAX. 60 - 120 SEC. TIME Figure 12. Recommended Pb-free reflow soldering profile. 100 SEC. MAX. 255 - 260 C 3C/SEC. MAX. 6C/SEC. MAX. Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT LED Indicator Components 6 2.00 0.05 8.00 0.10 4.00 0.10 1.50 + 0.10 -0 1.75 0.10 5.50 0.05 2.20 0.10 C 12.00 C + 0.30 - 0.10 1.50 0.25 0.279 0.10 A 2.20 0.10 Figure 13. Carrier Tape Dimension 1.4 180 1 60.0 0.5 Label Area 13.4 0.5 16.2 0.5 Figure 14. Reel Dimension USER FEED DIRECTION PIN 1 PRINTED LABEL Figure 15. Reeling Orientation 7 Intensity Bin Select (X2, X3) Individual reel will contain parts from 1 half bin only Min Iv Bin (Minimum Intensity Bin) X2 0 A Intensity Bin Limits Bin ID R1 R2 S1 S2 T1 T2 U1 U2 0 4 Min (mcd) 112.5 140.0 180.0 224.0 285.0 355.0 450.0 560.0 Max (mcd) 140.0 180.0 224.0 285.0 355.0 450.0 560.0 715.0 Red 0 SI Green 0 T1 Blue 0 R1 Number of Half bin from X2 X3 0 A Red 0 4 Green 0 4 Blue Tolerance of each bin limit 12% Note: 0 represents no maximum bin limit Color Bin Limits Red Full distribution Color Bin Select (X4) Individual Reel will contain part from 1 full bin only Color Bin Combinations X4 0 Min (nm) 618.0 Max (nm) 628.0 Green Blue B&C C D Min (nm) 525.0 530.0 Max (nm) 530.0 535.0 Red Full distribution Green C&D Blue B C Min (nm) 465.0 470.0 Max (nm) 470.0 475.0 Tolerance of each bin limit is 1 nm 8 Packaging Option (X5) Option 2 Test Current 20mA Package Type Top mount Reel Size 7 inch CIE 1931 - Chromaticity Diagram 0.90 0.80 CD 0.70 Green 0.60 Y - COORDINATE 0.50 0.40 0.30 0.20 Blue 0.10 0.00 C B 0.20 0.30 0.40 0.50 X-COORDINATE 0.60 0.70 0.80 Red 0.00 0.10 9 Handling Precaution The encapsulation material of the product is made of silicone for better reliability of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembly of handling, the unit should be held on the body only. Please refer to Avago Application Note AN 5288 for detail information. B. Control after opening the MBB * The humidity indicator card (HIC) shall be read immediately upon opening of MBB. * The LEDs must be kept at <30C / 60%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 672 hours. C. Control for unfinished reel * For any unuse LEDs, they need to be stored in sealed MBB with desiccant or desiccator at <5%RH. Moisture Sensitivity This product is qualified as Moisture Sensitive Level 2a per Jedec J-STD-020. Precautions when handling this moisture sensitive product is important to ensure the reliability of the product. Do refer to Avago Application Note AN5305 Handling of Moisture Sensitive Surface Mount Devices for details. D. Control of assembled boards * If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have exceeded their floor life of 672 hours A. Storage before use * Unopen moisture barrier bag (MBB) can be stored at <40C/90%RH for 12 months. If the actual shelf life has exceeded 12 months and the HIC indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. * It is not recommended to open the MBB prior to assembly (e.g. for IQC). E. Baking is required if: * "10%" or "15%" HIC indicator turns pink * The LEDs are exposed to condition of >30C / 60% RH at any time. * The Led floor life exceeded 672hrs. Recommended baking condition: 605C for 20hrs For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries. Data subject to change. Copyright (c) 2008 Avago Technologies Limited. All rights reserved. AV02 -1038EN - March 4, 2008 |
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